SEMATECH Dictionary of Semiconductor Terms

A-Am | An-Az | B | C-Ch | Ci-Com | Con-Cz | D-De | Df-Dz | E-En | Eo-Ez | F-Fl
Fm-Fz | G | H | I | J-K | L | M-Mes | Met-Mz | N | O | P-Ph | Pi-Pq | Pr-Pz | Q | R
S-Se | Sh-So | Sp-Sta | Ste-Sz | T-Th | Ti-Tz | U-V | W-Z

"J & K "

JIT		see just-in-time (JIT) delivery.
J-lead n		an integrated circuit package lead configuration that in cross-section resembles the letter J. [SEMATECH]
job aid n		any device (whether in written, mechanical, electronic, or other form) that can be used by a worker to facilitate the performance of a job or task. [SEMATECH]
junction		see pn junction.
junction-to-ambient thermal resistance () n		the thermal resistance from the semiconductor junction to a specified point in the surrounding ambient atmosphere. The thermal resistance is given by the temperature difference between the two points per unit of power dissipation into the semiconductor junction and is measured in degrees C/watt. [SEMI G42-88] Also called junction-to-specified reference point thermal resistance.
junction-to-case thermal resistance () n		the thermal resistance from the semiconductor junction to a specified point on the exterior of the package. The thermal resistance is given by the temperature difference between the two points per unit of power dissipation and is measured in degrees C/watt. [SEMI G43-87]
junction-to-specified reference point thermal resistance n		see junction-to-ambient thermal resistance.
junction spiking n		the penetration of a junction by aluminum, which occurs when silicon near the junction dissolves in aluminum and migrates along the interconnect lines. Aluminum then replaces silicon at the junction. [SEMATECH]
junction temperature (TJ) n		in measuring the thermal resistance of semiconductor device packages, the temperature of the semiconductor junction in which the major part of the heat is generated. The measured junction temperature is indicative only of the temperature in the immediate vicinity of the element used to measure the temperature. Junction temperature is measured in degrees Celsius. [SEMI G38-87] Also see integrated circuit (The "J" part of the abbreviation is written with a subscript capital letter.)
just-in-time (JIT) delivery n		an inventory-control method of ordering process materials on an as-needed basis; eliminates much of the expense and many of the environmental concerns of maintaining an onsite inventory. [SEMATECH]
kerf		see scribe line.
key word n		the word or words that designate a degree or level of hazard. Some key words that may be used are very dangerous, high hazards, warning, danger, caution, attention, and notice. [SEMI S1-90] Also called signal word.
KGD		see known good die.
kinking n		a collapse of the tube wall caused by excessive bending. [SEMI F9-92]
Kirkendall void n		voids induced in a diffusion couple between two metals that have different interdiffusion coefficients. [SEMATECH]
knot n		in flat panel display substrates, an embedded, glassy, transparent lump with an irregular or tangled appearance. Its size is usually determined by the size of the distorted area. [SEMI D9-94]
known good die (KGD) n		fully tested die [possibly burned-in] that are ready for bonding into multichip modules (MCM). [1994 National Technology Roadmap for Semiconductors]

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