SEMATECH Dictionary of Semiconductor Terms

A-Am | An-Az | B | C-Ch | Ci-Com | Con-Cz | D-De | Df-Dz | E-En | Eo-Ez | F-Fl
Fm-Fz | G | H | I | J-K | L | M-Mes | Met-Mz | N | O | P-Ph | Pi-Pq | Pr-Pz | Q | R
S-Se | Sh-So | Sp-Sta | Ste-Sz | T-Th | Ti-Tz | U-V | W-Z

"I"


IC
n

see integrated circuit.


ICP
n


see inductively couple plasma.


IDDQ
n


abbreviation for direct drain quiescent current. (The "DDQ" part of the abbreviation is written with subscript capital letters.) See static current test.


IDEAL
n


a five-phased approach to improving a software process. Abbreviation represents the five phases: initiating, diagnosing, establishing, acting, and leveraging. [SEMATECH]


IDLH
 

n see immediately dangerous to life and health.


IF
n
 

see interface.


I line
n (adj I-line)


exposure wavelength of 365 nm. [SEMATECH]


illumination, Kohler
n
 

see illumination, Koehler.


illumination, Koehler
n
 

in reflected-light microscopy, a specular illumination system used directly for the brightfield mode and as preliminary setup for all other modes except darkfield. The image of the field diaphragm is focused on the specimen surface, and the image of an undiffused lamp source is focused in the plane of the aperture diaphragm. [ASTM E7-90]


image
n
 

1 : any single geometric form appearing in a layout as
  • a part of a master drawing or layout (image, drafting)
  • projected on a screen or viewed, usually at some magnification or reduction (image, optical)
  • etched in the silicon dioxide layer on an oxidized silicon wafer (image, oxide)
  • in a photomask or in the emulsion of a photographic film or plate (image, photographic)
  • an exposed and developed coating on a substrate (image, photoresist)
[ASTM F127-84 and SEMI P25-94] 2 : in scanning tunneling microscopy, representation of surface topography obtained using the signal from the tip or surface during rastering and under tunneling conditions. [SEMATECH] 3 : in atomic force microscopy, representation of surface topography obtained by using the signal from the cantilever or surface during rastering in constant force conditions. [SEMATECH]


image field
n
 

in the measurement of photolithographic instruments, the extent of the image along the X and Y axes. It may be defined by the limits of image quality, as a practical matter, for the intended application. [SEMI P25-94]


imaging
n
 

see lithography.


imbedded abrasive grains
n
 

on a semiconductor wafer, abrasive particles mechanically forced into the surface. [ASTM F1241]

immediately dangerous to life and health (IDLH)
n
 
the maximum concentration of a hazardous material from which one could escape within 30 minutes with no escape-impairing symptoms or irreversible health effects. The National Institute of Occupational Safety and Health (NIOSH) recommends use of IDLH to select appropriate respirators. If adequate data does not exist for the precise establishment of the IDLH data, an independent certified industrial hygienist, industrial toxicologist, or appropriate regulatory agency should make this determination. [SEMI S2-91] .


impact test
n
 

in component testing, a test performed to determine particle contribution as a result of mechanical shock to the component. [SEMATECH]


imperfect bead
n
 

in an ion-exchange resin, a cracked, pocked, or fragmented bead. [SEMATECH]


implant
n
 

see ion implantation.


implemented environment
n
 

the actual code, tools, people, repositories, and procedures for developing, integrating, and executing applications. [SEMATECH]


impurity
n
 

a chemical or element added to silicon to change the electrical properties of the material. [SEMATECH] Also see dopant and ion implantation.


inboard test
n
 

in determining leak rate, test of the inward leakage from exterior to interior when the external pressure is greater than the internal pressure within the test component. [SEMATECH]


inclusion
n
 

discrete second phases (oxides, sulfides, carbides, intermetallic compounds) that are distributed in a metal matrix. [SEMATECH]


Incorrect Reception
n
 

see NAK.


incremental design
n
 

see design process.


indent
n
 

on a semiconductor wafer, an edge defect that extends from the front surface to the back surface. [ASTM F1241] Contrast chip.


index of refraction
n
 

the relative index of refraction defined by Snell's law as the ration of the sine of the angle of incidence to the sine of the angle of refraction. [ASTM F1241]


indirect alignment
n
 

in the surface roughness measurement of flat panel display glass substrates, the mechanical positioning of (a) alignment marks on the FPD substrate to one set of reference points in the stepper, and (b) alignment marks on the reticle(s) to a second set of reference points in the stepper. [SEMI D8-94] Contrast with direct alignment.


inductively coupled plasma (ICP)
n
 

a plasma that is driven by a current oscillating in a coil, either around or adjacent to the vacuum vessel. The oscillating current gives rise to a time-varying magnetic field in the gas, which induces a local electric field, which accelerates electrons and excites the plasma. [SEMATECH]


inert gas
n
 

a gas that, at ambient conditions, does not react chemically with other materials. [SEMI S4-92]


infant mortality
n
 

the early portion of the bathtub curve at which the failure rate declines with exposure to time. [SEMATECH]


inflammation
n
 

the protective response of tissues of the body to irritation or injury; may be acute or chronic; characterized by redness, heat, swelling, or pain and accompanied by loss of function. [SEMATECH]


information
n
 

the combination of data and the meaning it conveys. [SEMI E13-91]


information model
n
 

the definition, attributes, and relationships of the data. Information models are used for sharing data among systems. [SEMATECH] Contrast data model.


infrared heater
n
 

a device for heating by means of radiant energy within the wavelength range of 770 to 106 nm. [Adapted from IEEE]


infrastructure
n
 

the understructure, that is, the supporting elements and components. For the semiconductor industry, the service and material suppliers as well as organizations involved in research and development, in finance and trade, and in other matters external to the producers of semiconductors but that are required for the industry to successfully operate. [1994 National Technology Roadmap for Semiconductors]


ingestion
n
 

the taking in of a substance through the mouth. [SEMATECH]


ingot
n
 

in silicon technology, a solid section of polycrystalline or single crystal silicon, generally of slightly irregular cylindrical or rectangular shape. [ASTM F1241]


inhalation
n
 

the breathing in of a substance in the form of a gas, vapor, fume, mist, or dust. [SEMATECH]


inheritance
n
 

in object-oriented programming systems, a mechanism whereby classes can make use of the methods and variables defined in all classes above them on their branch of the class hierarchy. [SEMATECH]


initial oxide
n
 

the first silicon oxide layer grown on the surface of a silicon wafer before the first pattern step. [SEMATECH]


initiate motion
n
 

in equipment exhaust systems, to use an exhaust stream to start contaminants or machine parts moving from a rest position. [SEMI S6-93]


inlet gauge
n
 

a pressure gauge, usually affixed to the body of the system regulator on the high-pressure side, that measures the pressure in the gas cylinder. [SEMI International Standards 1990, Vol. 1, Glossary]


inlet mass flow controller calibration pressure
n
 

see mass flow controller calibration pressure, inlet and outlet.


inlet normal operating pressure
n
 

see normal operating pressure, inlet and outlet.


inlet reference operating pressure
n
 

see reference operating pressure, inlet and outlet.


inlet pressure
n
 

in a mass flow controller, the pressure at the inlet fitting of the device. [SEMI E28-92]


inline measurement
n
 

a measurement made on a silicon wafer while the wafer resides in any portion of a processing tool or work cell except the processing chamber. [SEMATECH]


inorganic
adj
 

describes materials that do not contain carbon. [SEMATECH]


input/output pins
n
 

see I/O pins.


in situ
adj
 

refers to processing steps or tests that are done without moving the wafer. Latin for "in original position." [SEMATECH]


in situ measurement
n
 

a measurement made while a silicon wafer resides in the processing chamber of a processing tool. [SEMATECH]


insoluble
adj
 

not capable of being dissolved. [SEMATECH]


inspection finish
n
 

a clear, transparent backside finish on a film. This type of finish allows optical inspection of films through the back surfaces. [SEMI M7-82]


instance
n
 

a particular occurrence of an object defined by a class. All instances of a class share the behavior implemented and inherited by the class. [SEMATECH] Contrast object instance.


instance variable
n
 

an aspect of the information that supports an instance's behavior. The instance variables collectively implement the instance's state. [SEMATECH]


instantiation
n
 

an object created from a class. [SEMATECH]


instructional aid
n
 

any device (whether written, mechanical, electronic, or other form) that can be used by a trainer, instructor, teacher, or student to help facilitate the teaching process. [SEMATECH]


insulator
n
 

a substance that will not conduct electricity; for example, silicon dioxide and silicon nitride. [SEMATECH] Contrast conductor.


integrated circuit (IC)
n
 

1 : two or more interconnected circuit elements on a single die. [SEMATECH] 2 : a fabrication technology that combines most of the components of a circuit on a single-crystal silicon wafer. [SEMI Materials, Vol. 3, Definitions for Semiconductor Materials]


integrated environment
n
 

an environment that allows new development to take advantage of the interoperability features of the environment. [SEMATECH]


integrated manufacturing
n
 

a unified view of the mechanisms required to create a finished product. Integrated manufacturing makes use of the relationships between the processes involved in manufacturing. [SEMATECH]


integrated minienvironment
n
 

a minienvironment that is an integral part of the tool. [SEMI E44-95]


integrated model repository (IMR)
n
 

in computer-integrated manufacturing (CIM), the repository of all information from the advanced development environment. The IMR retains information about the application or system being developed or integrated from each phase of the application development environment life cycle; it focuses on capturing the required information from each succeeding phase of the life cycle as well as feeding backward other information; and it maintains models for application as well as libraries of reusable design and code. [SEMATECH]


integrated standard mechanical interface (SMIF)
n
 

a unit that includes a SMIF port and a mechanism for indexing the port door, and which is entirely incorporated within the tool. [SEMI E44-95]


integrity
n
 

of resists, the quality of a resist measured in terms of properties such as chemical resistance, permeability, edge adhesion, and incidence of pinholes. [SEMATECH]


interactive design
n
 

a design environment that facilitates close interaction between the designer and an automatic tool. [1994 National Technology Roadmap for Semiconductors]


interactive transfer
n
 

in automated material movement, a transfer in which both partners are active and must interact in the performance of the transfer. [SEMI E32-94]


interbay automated material handling system
n
 

in semiconductor manufacturing, an automated material handling system (AMHS) for transporting cassettes or boxes of wafers from one process bay to another. [SEMATECH]


interconnect
n
 

1 : a highly conductive material, usually aluminum or polysilicon, that carries electrical signals to different parts of a die. [SEMATECH] 2 : the wiring between elements on a die, package, or board. [1994 National Technology Roadmap for Semiconductors]


interconnect density
n
 

the patterns of electrical conductors that are provided both on and off semiconductor die to connect circuit elements and to interface with other system elements; the number of such conductors that are provided in a 1- or 2-dimensional space per dimension unit. Alternatively, interconnect density may be defined by the conductor pitch that is the sum of the conductor width and the space to the next conductor. [1994 National Technology Roadmap for Semiconductors]


interconnected environment
n
 

an environment consisting of a collection of independent monolithic systems, islands of systems, and programs that have been partially interfaced or bridged together. [SEMATECH]


interface (IF)
n
 

1 : of an epitaxial wafer, the boundary between the substrate of an epitaxial layer as determined by a specific measurement method such as infrared reflectance or spreading resistance profiling. DISCUSSION-If determined by the infrared reflectance method, the position of the interface depends on the optical properties of the layer and the substrate. If determined by spreading resistance, the position of the interface is determined as follows:
  • For a boundary between two layers (or a layer and a substrate) of the same conductivity type, the interface is taken as the point at which the resistivity increases to twice the local minimum value it has in the region of lower resistivity.
  • For a boundary between two layers (or a layer and substrate) of opposite conductivity type, the interface is taken as the point at which the local maximum of resistivity occurs.
[ASTM 1241] 2 : a shared boundary. Examples include a hardware component that links two devices or a portion of storage or registers accessed by two or more computer programs. [SEMATECH] Also see substrate and epitaxial layer. 4 v : to interact or communicate with another component or entity within a computer network. [SEMATECH]


interface plane
n
 

in cluster tools, the vertical surface defined by the mating flange surfaces of two joined modules. [SEMI E21-94]


interface seal zone
n
 

an absolute surface or face reserved for the establishment of an environmental seal between modules. [SEMI E21-94]


interference contrast microscope
n
 

a microscope that reveals surface details of an object in which there is no appreciable absorption by using the interference between two beams of light. [Adapted from ASTM F1241]


interfering
n
 

in automated material movement, a situation in which any of a dynamic port's associated mechanisms are positioned where they are capable of physically obstructing a transfer. [Adapted from SEMI E32-94]


interferometer
n
 

an instrument for measuring deviations of a surface from a reference plane by means of the interference phenomena of light. [SEMATECH]


interferometer clear aperture
n
 

the largest unobstructed area that can be tested by an interferometer. [ASTM F1241]


interferometer reference wavefront
n
 

in optics, one of the two or more wavefronts that will interfere to form an interferogram. [ASTM F1241] Also see interferometer.


interferometer sensitivity (d) n
 

in optics, the physical distance or elevation represented by one interference fringe. [ASTM F1241] Also see interferometer.


interfield overlay
n
 

see overlay, interfield.


interlevel dielectrics
n
 

an insulating film between two conductive film layers, as between poly and aluminum or between layers of aluminum. [SEMATECH]


interleaf
n
 

in the ionic contamination testing of semiconductor leadframes, a paper or plastic film that is placed between layers of semiconductor leadframe strips to prevent tangling. [SEMI G59-94]


internal lead
n
 

in a plastic or cerdip/cerpack package leadframe, the sections of the leads that are inside the package body outline and more specifically relate to the area designated for wire bonds. [SEMATECH] Contrast external lead.


internal partial scan
n
 

see internal scan.


internal scan
n
 

a scan path that includes only internal registers of an integrated circuit. [1994 National Technology Roadmap for Semiconductors] Also called internal partial scan.


interoperability
n
 

the ability of two or more systems to exchange information and to mutually use the information that has been exchanged. [SEMATECH] Contrast compatibility.


interposer
n
 

an electrical interconnection structure used between a silicon integrated circuit die and package, test jig, or other die that enables a reduced contact pad pitch on the die. [1994 National Technology Roadmap for Semiconductors]


interposing relay
n
 

a device that enables the energy in a high-power circuit to be switched by a low-power control signal. [1994 National Technology Roadmap for Semiconductors]


interpreter
n
 

the system that interprets a primary message (a first message) at its destination and generates a reply when requested. [SEMI E5-92] Contrast originator.


interstitial
n
 

in a crystalline solid, an atom that is not located on a lattice site. [SEMATECH]


intertool port resource
n
 

in cluster tools, a resource associated with a location in the intertool environment that can operate on behalf of the cluster tool during material transfer between the intertool environment and the cluster tool. An intertool port resource is analogous to a port resource. [SEMATECH]


intertool transport
n
 

wafer or cassette movement between independent cluster tools. [SEMI E21-94] Contrast intratool transport.


intrabay automated material handling system
n
 

in semiconductor manufacturing, an automated material handling system (AMHS) for transporting cassettes or boxes of wafers within one process bay. [SEMATECH] Also called tool-to-tool automated material handling system.


intrafield overlay
n
 

see overlay, intrafield.


intratool communications interface
n
 

the method of communicating among the modules of a single cluster tool. [SEMATECH]


intratool transport
n
 

wafer movement inside a cluster tool. [SEMI E21-94] Contrast intertool transport.


intrinsic semiconductor
n
 

a semiconductor in which the density of electrons and holes is approximately equal. [SEMATECH] Contrast extrinsic semiconductor.


ion emitter
n
 

equipment that ejects ions from the surface of a substance into the surrounding space. [SEMATECH]


ion-exchange resin
n
 

1 : a polymeric material used in ultrapure water systems to remove unwanted impurities from the liquid stream. 2 : a synthetic organic, ion-exchange material. [SEMATECH]


ion implantation (I2, II)
n
 

a high-energy process that injects an ionized species such as boron, phosphorus, arsenic, or other ions into a semiconductor substrate. [SEMATECH]


ion permeation
n
 

in cleanroom gloves, the tendency of ionic species to migrate from the interior glove surface to the exterior glove surface. [SEMATECH]


I/O pins
n
 

connections to an integrated circuit through which input and/or output (I/O) signals pass. [1994 National Technology Roadmap for Semiconductors]


Ironman
n
 

a program that subjects a new piece of equipment to rigorous, round-the-clock testing designed top identify and correct causes of failure. Abbreviation stands for improved reliability of new machines at night. [SEMATECH]


irritant
n
 

a chemical that is not corrosive but that causes a reversible inflammatory effect on living tissue by chemical action at the site of contact. A chemical is a skin irritant if, when tested on the intact skin of albino rabbits by the method of 16 CFR 1500.41, following an exposure period of four hours or by other appropriate techniques, it results in an empirical score of five or more. [SEMI S4-92]


island
n
 

see isolated line.


isolated high-pressure purge system
n
 

a high-pressure purge system that isolates the pressure regulator from the purged volume by means of a shutoff valve. Three valves are required: a purge gas inlet valve, a high-pressure vent valve, and a high-pressure isolation valve. [SEMI International Standards 1990, Vol. 1, Glossary]


isolated line
n
 

a clear field, dark line. [SEMI P19-92] Also called island.


isolated space
n
 

a dark field, clear line. [SEMI P19-92] Also called opening. Also see contact, trench, and window.


isolation
n
 

an electrical separation of regions of silicon on a wafer; for example, boron diffusion to isolate a transistor. [SEMATECH] Also see dielectric isolation.


isolation gap
n
 

in ceramic packages, the metal-free space between two metallized areas. [SEMI G22-86]


isolation of gases
n
 

the National Fire Codes use the terms, "separated," "segregated," and "isolated" when referring to storage of hazardous materials. Isolation is defined by National Fire Protection Association (NFPA) 49 as "storage away from incompatible materials in a different storage room or in a separate and detached building located at a safe distance." [Adapted from SEMI S4-92]


isolation valve
n
 

1 : in cluster tools, a mechanical component used at an interface plane to permit environmental isolation between the transport module and an attached module. There is always one isolation valve under the control of the transport module. [SEMATECH] 2 : in the pressure testing of fluorocarbon tube fittings, a valve used to separate high-temperature fluid from high-pressure fluid, or to separate the samples from each other. [SEMI F10-93]


item
n
 

a data element within a message. NOTE-An item is an information packet that has a length and an item format defined by the first two, three, or four bytes of the item. [SEMI E5-92]


item format
n
 

a code used to identify the data type of an item (a data element within a message). NOTE-Bits 3 through 8 of the item header define the format of the data that follows. [SEMI E5-92]


item header
n
 

the first two, three, or four bytes of an item. [SEMI E5-92]


A-Am | An-Az | B | C-Ch | Ci-Com | Con-Cz | D-De | Df-Dz | E-En | Eo-Ez | F-Fl
Fm-Fz | G | H | I | J-K | L | M-Mes | Met-Mz | N | O | P-Ph | Pi-Pq | Pr-Pz | Q | R
S-Se | Sh-So | Sp-Sta | Ste-Sz | T-Th | Ti-Tz | U-V | W-Z

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