SEMATECH Dictionary of Semiconductor Terms

A-Am | An-Az | B | C-Ch | Ci-Com | Con-Cz | D-De | Df-Dz | E-En | Eo-Ez | F-Fl
Fm-Fz | G | H | I | J-K | L | M-Mes | Met-Mz | N | O | P-Ph | Pi-Pq | Pr-Pz | Q | R
S-Se | Sh-So | Sp-Sta | Ste-Sz | T-Th | Ti-Tz | U-V | W-Z

"Ci - Com"

CIM		see computer-integrated manufacturing.
circuit n		the combination of a number of connected electrical elements or parts to accomplish a desired function. [SEMATECH]
circuit design n		techniques used to connect active (transistors) and passive (resistors, capacitors, and inductors) elements in a manner to perform a function (that is, logic, analog). [1994 National Technology Roadmap for Semiconductors]
circuit geometries n		the relative shapes and sizes of features on a die. [SEMATECH]
clamped condition n		the fixing of a semiconductor wafer to a chuck as by vacuum. [SEMATECH]
class n		1 : a set of objects that share a common behavior. The terms class and type are usually (but not always) interchangeable; a class is a slightly different concept, in that it emphasizes the importance of hierarchies. [SEMATECH] 2 : defines the methods, messages, and properties of a similar group of objects (the objects are instances of the class). Classes themselves may be objects. [SEMATECH] 3 : a template for defining the methods and variables for a particular type of object. All objects of a given class are identical in form and behavior but contain different data in their variables. [SEMATECH]
class hierarchy n		defines the inheritance scheme for a collection of classes. a
class library n		a collection of object-oriented programming system (OOP) classes and methods belonging to a specific domain. For example, a graphics library may exist consisting of classes of graphical objects. [SEMATECH]
clean n		an operation that removes contaminants, particles, or resists from the surface of a substrate. [SEMATECH]
cleanroom n		a confined area in which the humidity, temperature, particulate matter, and contamination are precisely controlled within specified parameters. The class of the cleanroom defines the maximum number of particles of 0.5-micrometer size or larger that may exist in one cubic foot of air in the designated area. For example, a class 1 cleanroom allows one such particle of any kind to exist in one cubic foot of space; a class 10 area may contain no more than 10 such particles in one cubic foot of space. [SEMATECH]
cleanroom interface chamber (CIC) n		a load lock through which wafers are transferred to or from the cleanroom environment, wafer carriers, or transport systems that supply the process equipment. No wafer processing is performed within the CIC. [SEMATECH]
clearance n		the minimum distance between the edges of sequentially applied images. [ASTM F127-84]
cleavage plane n		1 : a crystal plane along which the material fractures smoothly when scribed or struck. [SEMATECH] 2 : a crystallographically preferred fracture plane. [ASTM F1241]
client n		an object that uses the functionality defined by another object (the server) to implement a certain portion of its own functionality. In this sense, a client delegates responsibility to the server. [SEMATECH]
clock n		a function that provides timestamping of event reports and alarm messages. The clock allows the equipment to be instructed by the host to set an internal clock to a time value specified by the host. The equipment can request the current date and time. [SEMATECH]
clock frequency n		the master frequency of the periodic pulses that synchronize operations of a logic circuit. [1994 National Technology Roadmap for Semiconductors]
closed secondary containment n		secondary containment that has a sealed annulus. In closed containment systems, the annular space either holds a certain pressure of gas or a certain level of vacuum. In closed containments a change in the pressure or vacuum would indicate a leak in either the primary or secondary system. [SEMI F6-92]
closure error		see cumulative pitch error.
cloud		see haze.
cluster controller n		1 : the processor, I/O subsystem, and software that controls the overall operation of an integrated manufacturing tool (cluster tool), including material sequencing, recipe and alarm handling, and other information-handling functions. [SEMATECH] 2 : the virtual semiconductor device responsible for control of an entire cluster tool. [SEMATECH]
cluster module n		an element of a tool that has well-defined functions and interfaces. It may contain other modules and may be either hardware or software. [SEMATECH]
cluster tool n		an integrated, environmentally isolated manufacturing system consisting of process, transport, and cassette modules mechanically linked together. The modules may or may not come from the same supplier. [SEMI E21-94]
cluster tool recipe n		a set of instructions for the processing of wafers through a sequence of integrated process modules (cluster tool); includes a sequence of process-module "visits" with a corresponding process-program reference. [SEMATECH]
CMOS		see complementary metal oxide semiconductor.
CMP		see chemical-mechanical polish.
coat v		1 : to cover a substrate surface with a layer of a material by the spinning of a resist. [SEMATECH] n 2 : the cover applied by the spinning of a resist. [SEMATECH] 3 : a step in the resist-apply operation in which a uniform film is applied to the entire face of a wafer. [SEMATECH]
coater n		equipment used to spin resist onto wafers. [SEMATECH] Also calledspinner and whirler.
coaxial cable n		an electrical transmission line that consists of a central inner conductor surrounded by a tubular outer conductor. Both conductors are separated and supported by an electrically insulating medium. [SEMATECH]
code n		an established convention that assigns elements of one character set to the elements of another set. [SEMATECH] Also see coded set and code element set.
coded set n		the character elements represented by a code element set. [SEMATECH]
code element set n		characters or character strings assigned to represent one or more individual characters or character strings of another group; for example, abbreviations, ASCII, or instruction code. [SEMATECH] Also called character code.
coefficient of thermal expansion (CTE) n		the increase in length or volume of a solid, liquid, or gas for a rise of 1 degree C at constant pressure. This coefficient is used, along with the glass transition temperature, to determine the expansion characteristics of molding compounds used in the manufacture of semiconductor packages. Usually, the linear coefficient is used for packaging considerations. [SEMATECH]
cofired adj		in the manufacture of some types of ceramic packages, the technology used to join together various ceramic layers and metallization patterns screen printed onto those layers by simultaneous firing at high temperature. [SEMI G22-86]
coherence n		1 : a property of electromagnetic waves that have a definite phase relationship to each other. [SEMATECH] 2 : a measure of the ability a source of electromagnetic radiation has to interfere. [ASTM F1241]
coil set n		longitudinal bowing of the leadframe strip caused by the set taken by the strip. Longitudinal bowing occurs due to storage of the raw copper strip in continuous coil form prior to cutting the strip to length for leadframes. [SEMI G9-89] Contrast crossbow. Also see package.
coined area n		the area at the tip of internal leads (bond fingers), which is flattened by a punch to produce an area suitable for wire bonding. The flattened area is defined by length and width (or as a minimum percentage of the bond finger area) and depth. [SEMI G2-87]
collection event n		1 : in communications and control of semiconductor manufacturing equipment, an event or grouping of related events on the equipment that is considered to be significant to the host. [SEMI E30-94] 2 : in equipment communications, an event that may be used to initiate the collection and reporting of data. A collection event may trigger an event report. A collection event may also start or stop one or more trace reports. [SEMI 2309, proposed]
collimator n		1 : a device of radiation-absorbent material intended for defining the direction and angular divergence of the radiation beam. [ASTM E1316-94] 2 : a piece of hardware placed between the sputtering cathode and the wafer during physical vapor deposition that filters out low-angled sputtered material and thus enhances step coverage into contacts and vias on the wafer surface. [SEMATECH]
collinear four-probe array		see four-point probe.
column n		the set of functional patterns lying along a Y-Y axis of a photomask. [ASTM F127-84]
combustible adj		easily ignitable and free-burning. [SEMATECH]
combustible liquid n		a liquid that is capable of burning and has a flash point greater than 37.8 degrees C (100 degrees F). [SEMATECH]
comet n		on a substrate, a buildup of resist shaped like a comet and generated by a defect. [SEMI P3-90] Also called motorboat.
COMETS		see WorkStream.
command n		an input that requires performance of a specific function by a computer program or operating system. [SEMATECH]
committed n		a method used in file systems and database management systems to ensure integrity. Data changes are made in a nonpermanent way until a complete logical transaction is completed. The changes are then made permanent as a group, or "committed." If there is a problem, all changes in the logical transaction are deleted or "rolled back." [SEMATECH]
common cause n		a source of variation that affects all the individual values of the process output being studied; in control-chart analysis, it appears as part of the random process variation. [EIA 557] Contrast special cause.
communication failure n		in communications and control of semiconductor manufacturing equipment, a condition that occurs when an established communications link is broken. In a SECS-I environment, this occurs when the protocol retry limit (RTY) is exceeded. [SEMI E30-94]
communications n		the sending and receiving of information between two devices. [SEMATECH]
communicating adj		in SECS communications, describes one of the two substates under the enabled state. In the communicating state, SECS communication with a host computer must be upheld. [SEMATECH] Also see disabled.
communication fault n		in communications and control of semiconductor manufacturing equipment, a condition that occurs when the equipment does not receive an expected message, or when either a transaction timer or a conversation timer expires. [SEMI E30-94]
compatibility n		the ability of one machine, such as a computer, to handle programs and data designed for a different machine type or model; the ability of two or more systems to exchange information. [SEMATECH] Contrast interoperabilty.
compensation n		1 : in an extrinsic semiconductor, reduction in the number of free carriers resulting from the presence of impurities other than the majority dopant density impurity. [ASTM F1241] 2 : in packaging, changes made to the nominal dimensions in order to design master artwork for a leadframe to be produced by etching. The changes compensate for process characteristics, such as etch factor or undercut. [SEMI G19-84]
compensation doping n		addition of donor impurities to a p-type semiconductor or of acceptor impurities to an n-type semiconductor. [SEMI Materials, Vol. 3, Definitions for Semiconductor Materials]
complementary metal oxide semiconductor (CMOS) n		a fabrication process that incorporates p-channel and n-channel MOS transistors within the same silicon substrate. [SEMATECH]
component n		1 : an individual electronic part, such as a device, diode, or capacitor that is fabricated in a metal oxide semiconductor or bipolar process. [SEMATECH] 2 : an individual piece or a complete assembly of individual pieces, including industrial products that are manufactured as independent units, capable of being joined with other pieces or components. The typical components referred to by the specification are valves, fittings, regulators, gauges, instrument sensors, a single length of tubing, several pieces of tubing welded together, tubing welded to fittings, and the like. [SEMI F1-90] 3 : the fundamental parts of an object, its entities, or relationships. [SEMATECH] 4 : the hardware and software that work in sets (functional entities) to perform the operation(s). [SEMATECH]
component object n		in equipment communications, an object that is part of an aggregation. [SEMI E39-94] Also see aggregation object.
composite cell n		an arrangement of several basic cells. [SEMI P19-92]
composite drawing n		a large-scale drawing that comprises all geometric forms, arranged in their proper relative positions, required for a single device. [ASTM F127-84] Also called composite pattern, design drawing, engineering drawing, layout, and master drawing.
compound transfer n		in automated material movement, a combination of two or more atomic transfers executed sequentially or concurrently to achieve a single goal, such as exchanging carriers or moving a carrier between process machines using a transfer agent. [Adapted from SEMI E32-94]
compressed gas n		a gas or mixture of gases in a closed container having an absolute pressure exceeding 40 psi at 70 degrees F. [SEMATECH]
computer-aided design (CAD) n		1 : the process of designing a part or assembly using a computer system to capture the designer's intent, produce drawings, and analyze the behavior of the object. [SEMATECH] 2 : the area of data processing concerned with the design, supply, operation, and support of systems performing such functions. [SEMATECH]
computer-aided manufacturing (CAM) n		the use of a computer to collect data from a process automatically or to control the operation of a machine. [SEMATECH]
computer-aided systems engineering (CASE) n		the application of computers to the creation, testing, and modification of software. [SEMATECH]
computer-assisted training n		an instructional or presentation program that is delivered by way of the computer; however, it may not have the high interaction and branching capabilities of a computer-based training program. [SEMATECH] Also see computer-based training.
computer-based training (CBT) n		a highly interactive instruction course designed and developed on a computer for delivery as a computer-based learning program. Some CBT programs may incorporate onboard user registration and evaluation as well as audio, video, and simulation capabilities. [SEMATECH]
computer-integrated manufacturing (CIM) n		1 : the integration of computer control and monitoring into a process of manufacturing. 2 : The integration, through computers, of manufacturing functions with other aspects of a business, such as sales, marketing, and product engineering. [SEMATECH]
computer-integrated manufacturing impact model (C(IM)2) n		a spreadsheet model developed by SEMATECH. C(IM)2 can be used to estimate the financial impact of CIM applications on semiconductor fabs. [SEMATECH]

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