Litho Forum

28-29 January 2004
Los Angeles, California


(All presentations and posters are in .PDF format)

Survey Results

Presentations

(Listed by Session Topic)

193 nm Immersion
      Bill Arnold, ASML
  Burn Lin, TSMC
  Ralph Dammel, Clariant
  Hideo Hata, Canon
  Sochi Owa, Nikon
  Mitsuro Sato, TOK
 
157 nm
  Jos Benchop, ASML
  Andrew Grenville, ISMT/Intel
  Konrad Knapp, Schott Lithotec
  Kurt Ronse, IMEC
  Takahashi, Canon
  Karen Turnquest, ISMT/AMD
  John Wiesner, Nikon
  Paul Zimmerman, ISMT / Intel
 
EUV
  Bob Akins, Cymer
  Jos Benchop, ASML
  Malcom Gower, Exitech
  Kevin Kemp, ISMT/Motorola
  Barry Lieberman, Intel
  Guido Schriever, XTREME
  Peter Silverman, Intel
  K. Ushida, Nikon
 
EPL
  Masaki Yamabe, Selete
  O. Hagarekawa, Hoya
  K. Suzuki, Nikon
  Masaki Yamabe, Selete
  M. Shoji, NCS
 
Charged Particle Maskless
  Brandstettter, IMS
  Pieter Kruit, Mapper
  Fabian Pease, Stanford
  Hans Pieffer, Consultant
 
Optical Maskless
  Kevin Cummings, Cummings
  Bill Oldham, University of California, Berkeley
 
Nano Imprint
  Chou, Princeton
  Doug Resnick, Motorola
  SV Sreenivasan, Molecular Imprints
  Grant Willson, UT
 
Mask Magnification
  Mask Magnification, Scott Hector
 

Posters

(Listed by Technology Focus)

157 nm
PerFluroPolyEthers (PFPEs): Toward an Optical Grade for IL Applications
 
193 nm
Designer Darkness: Using phase shifts and singularities to pattern nano-scale structures optically
 
Ebeam
Advanced solutions for electron beam lithography
Distributed Axis Electron Beam System for Lithography and Inspection
 
EPL
200mm Mask w 70nm Node Device Pattern
Characterizing the Spacial Iniformity of Thin Film Stress of 200nm pf EPL Masks
Collapse Behavior & Key Parameter
Concept of PEC
Cryogenic Aerosol Cleaning
Current Performance of NSR-EB1A
Data Conversion System PATACON PC Cluster for EPL
Data Conversion System with EPLON
Exposure Cost of 65nm Node SOC Device
FFA EPL Resist Performance
Focus Lattitude
Mask Too Repair
Negative Tone Resist Performance w 100kv EB ColumnTOK.pdf
Particle Free Reticle Handling
Proximity Correction Softward for EPL
SCC02 for Dry Photolithography
Selete EPL Program
Status of Technology Development 1
Stencil Mask Inspection System
Stencil Mask
 
EUV
At Wavelength Inspection
Lithography Progress
Tech Summary
 
Maskless
PML2
Zone Plate Array Lithography
 
Optical
Cost Effective Optical Litho
 
X-Ray
Lithography for Printing Sub 90nm Contact Holes & Vias