Click on a session name to view presentation and speaker information.
Wednesday, October 24, 2007 |
Thursday, October 25, 2007 |
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Session 1: Fab Productivity Sponsored by ATMI Session 2: Energy & Environment Sponsored by Applied Materials Session 3: Statistical Methods I Session 4: Yield/Metrology Session 5: Equipment Productivity Session 6: Challenges in ESH Management Session 7: Statistical Methods II Session 8: Fab Productivity II |
Session 9: Statistical Methods in Yield and Metrology Session 10: Trends in Fab Design Session 11: Fab Productivity III Session 12: e-Manufacturing Session 13: Panel Discussion Session 14: Fab Transition Strategy |
Wednesday, October 24, 2007 |
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| 07:00 AM | Breakfast - Atrium | |||
| Welcome/Introductions/Keynote Session Chairs: Mike Schwartz |
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| 08:00 AM | Opening Remarks Presenter: Mike Schwartz, ISMI |
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| 08:05 AM | Welcome and Introductions Presenter: Scott Kramer, ISMI |
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| 08:15 AM | Keynote: Call to Action on the Next Generation Factory Presenter: Douglas Grose, AMD, Sr. Vice President Tech. Dev, Mfg & Supply Chain View abstract |
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| Session 1: Fab Productivity Sponsored by ATMI Session Chairs: Mike Schwartz |
Session 2: Energy & Environment Sponsored by Applied Materials Session Chairs: James Beasley |
Session 3: Statistical Methods I Session Chairs: Diane K. Michelson |
Session 4: Yield/Metrology Session Chairs: Dilip Patel |
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| 09:25 AM | Using RFID To Track Lot Location In A 200mm Wafer Fab - Impact On Fab Performance Presenter: Shivcharan Kamaraju, Freescale Semiconductor View abstract |
Applied Materials Program to Reduce Product Environmental Impact Presenter: Mark Denome, Applied Materials View abstract |
Dual Response Surface Methods (RSM) to Make Processes More Robust Presenter: Mark Anderson, Stat-Ease, Inc. View abstract |
Implementation of Wafer Edge Inspection to Support Process Optimization Presenter: Jeff Ritchison, Texas Instruments/DMOS6 Yield Enhancement View abstract |
| 09:50 AM | Centralized Metrology Presenter: Harald Bloess, Qimonda View abstract |
Wastes to Riches: An Environmental Performance Success Story at Spansion Presenter: Michael Frisch, Spansion View abstract |
Matching CD-SEM Tools for Feature Size Measurement Results in a High Volume Production Operation Presenter: Robert Henderson, Samsung Austin Semiconductor View abstract |
Residual Detection System for Copper CMP Presenter: Christopher Brannon, Spansion Inc. View abstract |
| 10:15 AM | Break - Atrium | |||
| Session 1: Fab Productivity Sponsored by ATMI (cont.) Session Chairs: Mike Schwartz |
Session 2: Energy & Environment Sponsored by Applied Materials (cont.) Session Chairs: James Beasley |
Session 3: Statistical Methods I (cont.) Session Chairs: Diane K. Michelson |
Session 4: Yield/Metrology (cont.) Session Chairs: Dilip Patel |
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| 10:40 AM | Real Time Dispatch for Gate/Poly Diffusion Furnaces Presenter: Vicki Schmitt, Texas Instruments View abstract |
Exhaust Solutions Qualification Presenter: Mohamed Alaoui, Novellus Systems View abstract |
Multivariate Analysis in Semiconductor Chamber Matching Presenter: Bruno Michel, MKS Instruments, Inc. View abstract |
Introduction of Advanced Surface Scattering Analysis in A Production Environment Using KLA-Tencor SURFmonitor Presenter: Andy Steinbach, KLA-Tencor View abstract |
| 11:05 AM | Dispatch Context Management - An Approach to Control and Maintain Dispatch Context Information Presenter: Thomas Quarg, AMD View abstract |
Intel and Water Conservation Presenter: Len Drago, Intel Corporation View abstract |
Enabling Technical Decisions with Tight Coupling between Engineering Statistics and ODBC Data Connectivity. Presenter: Michael Haslam, National Semiconductor View abstract |
Extracted Tunnel-Defect by Using Spectroscopic Ellipsometry on Metal Gate of DRAM Presenter: Shih-Jung Lee, KLA-Tencor View abstract |
| 11:30 AM | Accelerated Yield Learning Through Dual-Source Manufacturing Presenter: Samuel Ramac, IBM View abstract |
Upgrading a Thermal Oxidizer is Friendly for the Environment and Your Wallet Presenter: Tricia Constandine, Texas Instruments View abstract |
Statistical SPICE Parameter Extraction Presenter: Edmund Russell, National Semiconductor View abstract |
Detection and Characterisation of Defects and Flatness Variations on Wafers Presenter: Andreas Nutsch, Fraunhofer IISB View abstract |
| 11:55 AM | High Productivity Combinatorial Analysis of Post-Cu CMP Cleans: The Effect of Queue Time on Cu Surface Presenter: Cuong Tran, ATMI View abstract |
Applied Global Services enabling Environmental Sustainability for Semiconductor Manufacturers Presenter: Andes Chan, Applied Materials View abstract |
With Apologies to Statisticians Everywhere: Observations and Recommendations for the Use of Cpk Presenter: Theresa Utlaut, Intel Corporation View abstract |
Yield Aware Process Control Solutions Presenter: Anthony Toprac, PDF Solutions View abstract |
| 12:30 PM | Lunch - Tent | |||
| Session 5: Equipment Productivity Session Chairs: Neal Marmillion |
Session 6: Challenges in ESH Management Session Chairs: James Beasley |
Session 7: Statistical Methods II Session Chairs: Diane K. Michelson |
Session 8: Fab Productivity II Session Chairs: Kurt Woolley |
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| 02:00 PM | Photo Hot Spot Reduction Strategies For Scanners Presenter: Eric Wagner, Texas Instruments DMOS6 View abstract |
SEMI International Standards and EHS Guidelines -- Tools for Effective EHS Management and Cost Control Presenter: Bettina Weiss, SEMI View abstract |
How Sampling Only 3 Prototype Lots Affects the CPK Confidence Interval (CI) Presenter: Joel Dobson, TI View abstract |
Improving Fab Stability Using The Training Within Industry Programs Presenter: Laura McClure, IBM Burlington Fab View abstract |
| 02:25 PM | Lithography Throughput Improvement Utilizing a Novel Focus Spot Removal Procedure Presenter: Brent Ames, Applied Materials View abstract |
Technology and Energy Efficiency Presenter: Tim Higgs, Intel View abstract |
Application of Lean Software Development Principles to SPC Engine Redesign Presenter: Jesse Steinfort, AMD View abstract |
The Book Club Learning Model: Guiding Organizational Transformation Presenter: John O'Sullivan, IBM View abstract |
| 02:50 PM | Productivity and Yield Analysis of the Novellus 200mm RPC Upgrade for Silicon Oxynitride and Silicon Nitride Films Presenter: Allen Evans, Spansion Inc./Fab 25 Thin Films View abstract |
Life Cycle Inventory Modeling Presenter: Sarah Boyd, Applied Materials View abstract |
A B=C (Analytics Business Process = Competitiveness): Increase Manufacturing Competitiveness by Architecting Business Processes Around the Analytics Required to Improve Them Presenter: Brad Hopper, TIBCO Spotfire View abstract |
WIP movement prediction by EPOS in IBM's 300mm fab Presenter: Horst Zisgen, IBM View abstract |
| 03:15 PM | Break - Atrium | |||
| Session 5: Equipment Productivity (cont.) Session Chairs: Neal Marmillion |
Session 6: Challenges in ESH Management (cont.) Session Chairs: James Beasley |
Session 7: Statistical Methods II (cont.) Session Chairs: Diane K. Michelson |
Session 8: Fab Productivity II (cont.) Session Chairs: Kurt Woolley |
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| 03:45 PM | New Brazed Pedestal for Novellus C2 Altus Presenter: Lars Kretschmer, Infineon Technologies View abstract |
R&D to Manufacturing: Closing the ESH Gap Presenter: Brian Raley, AMD View abstract |
Are Equipment Maintenance Fundamentals Missing in Action? Presenter: Jennifer Kalmbach, agileTCP View abstract |
Real Time Lot/Wafer ETEST/WET Disposition using Rule-Based Knowledge System Presenter: Chin Sun, Quality Wise Knowledge Solutions View abstract |
| 04:10 PM | Implanter Source Life and Stability Improvement Using In-Situ Chemical Cleaning Presenter: Terry Romig, Texas Instruments View abstract |
Regulatory Challenges for Small Quantity Chemical Shipments: Containerized Chemicals Presenter: Lauren Crane, Applied Materials View abstract |
You Can't Flunk Your CFO - Teaching Statistics to ALL Learning Styles Presenter: Kathy B Hall, Hewlett Packard View abstract |
Electron Beam Direct Writing Technology Combined with Silicon Shuttle Service Presenter: Haruo Tsuchikawa, e-Shuttle, Inc View abstract |
| 04:35 PM | Measurement of the Electrostatically Driven Component of Microcontamination in Several 300 mm Process Tools Presenter: Larry Levit, MKS, Ion Systems View abstract |
Information Management for Environmental Concerns and Regulatory Requirements Presenter: John Messina, NIST View abstract |
You can't flunk your CFO - Teaching Statistics to ALL Learning Styles Presenter: Madhuri Mulekar, Department of Mathematics & Statistics, University of South Alabama, View abstract |
Using Electrostatic Discharge (ESD) Event Detection as a Predictive Maintenance Technique Presenter: Andrew C Rudack, SEMATECH View abstract |
| 05:00 PM | Reception/Technical Poster Session/Exhibits - Atrium | |||
Thursday, October 25, 2007 |
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| 07:00 AM | Breakfast - Atrium | |||
| Session 9: Statistical Methods in Yield and Metrology Session Chairs: Diane K. Michelson |
Session 10: Trends in Fab Design Session Chairs: James Beasley |
Session 11: Fab Productivity III Session Chairs: Robert Wright |
Session 12: e-Manufacturing Session Chairs: Brad Van Eck |
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| 08:30 AM | A Data Mining Exercise in Yield Modeling Presenter: Helen Hu, AMD View abstract |
Fab Trend Design at Texas Instruments Presenter: David Reed, Texas Instruments |
A Fab Model to Determine Optimal Operating Strategy Presenter: Sue van Oss, IBM View abstract |
Tool Modeling Challenges for Fab-Wide Deployment of Interface A Presenter: Larry Barto, AMD View abstract |
| 08:55 AM | An Effective Way of Approaching Lot Based WPA Signals by Utilizing Time Based PARETO Analysis Methods Presenter: Mike McIntyre, AMD View abstract |
Future Fab Concepts and Sustainable Design Presenter: Joe Mattrey, M W Zander View abstract |
A PPH based Approach for Manufacturing Productivity Improvement Presenter: Frank Liu, Texas Instruments, Inc. View abstract |
The Changing Scene of Software Technology: Leveraging Free and Open Source to Benefit Manufacturing Automation Presenter: Jared Warren, Adventa Control Technologies, Inc. View abstract |
| 09:20 AM | Motorcycle Clustering and Multidimensional Scaling Presenter: Wayne Drews, Rochester Institute of Technology View abstract |
Future Fab Trends Presenter: Michael O'Halloran, CH2M HILL |
Line Model for Wafer Fabs based on Little's Law Presenter: Thomas Quarg, AMD Saxony LLC & Co. KG View abstract |
Improving Process Control For Diffusion Furnaces Presenter: Chris Lansford, Spansion, Fab25 Diffusion View abstract |
| 09:45 AM | Break - Atrium | |||
| Session 9: Statistical Methods in Yield and Metrology (cont.) Session Chairs: Diane K. Michelson |
Session 10: Trends in Fab Design (cont.) Session Chairs: James Beasley |
Session 11: Fab Productivity III (cont.) Session Chairs: Robert Wright |
Session 12: e-Manufacturing (cont.) Session Chairs: Brad Van Eck |
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| 10:15 AM | In-Line Methodology For Defectivity Control From Wafer Inspection To Defect Root Cause Analysis Using FIB Cut Presenter: Denis David, Applied Materials View abstract |
300mm Fab Trends Presenter: Mark Osborne, FabTech |
Using Software Tools to Analyze Cycle Time Impact of Process Changes Presenter: Ben Wheeler, IBM View abstract |
EES for Process Engineers: Techniques and Benefits for Using Detailed Equipment Data Presenter: Alan Weber, Alan Weber & Associates, Inc. View abstract |
| 10:40 AM | Metrology Control: Concepts & Challenges in a Case Study from IC Test Presenter: Kathy Hall, Hewlett Packard View abstract |
Panel Discussion | Using Industrial Engineering Methodologies to Evaluate and Implement AMHS Improvement Projects Presenter: Andrea Zittel, Texas Instruments DMOS6 300mm View abstract |
Innovations in Assembly/Test Manufacturing Automation for the Nano-Technology Era Presenter: Aziz Safa, Intel Assembly Test Technology Development View abstract |
| 11:05 AM | Reliability Analysis of Rare Events Presenter: William D Heavlin, Google View abstract |
Panel Discussion | 300mm Factory Productivity - Cycle Time Sensitivity Analysis Presenter: Daniel Babbs, Brooks Automation |
e-Diagnostics Usage to Monitor and Improve Photolithography Equipment Health and Performance Presenter: Gary Sharp, Nikon Precision, Inc. View abstract |
| 11:30 AM | Lunch - Tent | |||
| Session 13: Panel Discussion | ||||
| 01:00 PM | Panel R&D Discussion: Moderator Dan Hutcheson, VLSI Research Inc. | |||
| 02:30 PM | Break - Atrium | |||
| Session 14: Fab Transition Strategy | ||||
| 03:00 PM | Introduction Overview | |||
| 03:10 PM | Next Generation Factory (NGF) Vision | |||
| 03:30 PM | 300mm NGF Projects | |||
| 04:00 PM | 450mm NGF Transition Program | |||
| 04:40 PM | Questions & Answers | |||
| 05:00 PM | NGF & 450mm Interactive Session | |||
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