Schedule of Technical Sessions Presentations and Speakers |
Return to Agenda-at-a-Glance | |||
Monday, October 09, 2006 |
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| Member Company Only Session | ||||
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| 04:00 PM | Registration Open | |||
| 05:00 PM | Reception/Exhibits/Poster Session | |||
Tuesday, October 10, 2006 |
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| 07:00 AM | Breakfast | |||
| Welcome and Introductions Session Chairs: Mike Schwartz |
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| 08:00 AM | Opening Remarks Presenter: Mike Schwartz, Meeting Chair; Scott Kramer, Director, ISMI |
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| 08:15 AM | Welcome Presenter: OB Bilous, SEMATECH, Board of Directors |
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| General Session/Keynote Session Chairs: Mike Schwartz |
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| 08:30 AM | Advanced SoC Manufacturing in Digital Consumer Electronics Era Presenter: Michihiro Inoue, Matsushita Electric Industrial Co., Ltd View abstract [PDF] |
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| Session 1: Fab Productivity Session Chairs: Mike Schwartz |
Session 2: ESH - Manufacturing Sustainability Session Chairs: James Beasley |
Session 3: Statistical Methods 1 - Approaches to Yield & Metrology Session Chairs: Diane K. Michelson |
Session 4: Simulation and Modeling Session Chairs: Robert Wright |
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| 09:25 AM | Productivity Improvements Through Range Management Dispatching In 300mm Wafer Manufacturing Presenter: Sameer Shikalgar, IBM View abstract [PDF] |
Enhancing Manufacturing Sustainability by Reducing Fab Liquid Wastes Presenter: Walter Worth, SEMATECH View abstract [PDF] |
Competing on Analytics Presenter: Brad Hopper, Spotfire, Inc. View abstract [PDF] |
The Exploitation of Manufacturing's 3rd and 4th Dimensions Presenter: James Ignizio, Intel Corporation/F11x ME View abstract [PDF] |
| 09:50 AM | Understand and Manage Work-Center Variability Presenter: Yutong Wu, IBM View abstract [PDF] |
Energy Reduction and Its Impact to Existing Semiconductor Manufacturing Facilities Presenter: Phillip Herman, Texas Instruments View abstract [PDF] |
Hierarchical Modeling Using GLMs to Improve Yield Presenter: Christina Mastrangelo, University of Washington View abstract [PDF] |
Integrated Capacity and Cycle Time Modeling and Optimization With EPOS Presenter: Horst Zisgen, IBM View abstract [PDF] |
| 10:15 AM | Break | Break | ||
| Session 1: Fab Productivity (cont.) Session Chairs: Mike Schwartz |
Session 2: ESH - Manufacturing Sustainability (cont.) Session Chairs: James Beasley |
Session 3: Statistical Methods 1 - Approaches to Yield & Metrology (cont.) Session Chairs: Diane K. Michelson |
Session 4: Simulation and Modeling (cont.) Session Chairs: Robert Wright |
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| 10:45 AM | Improving Fab Productivity Through Organizational Change Presenter: Steve Eckhart, Hewlett-Packard View abstract [PDF] |
Two Generations Ahead - Intel's Wastewater Goal Setting Process Presenter: John Currier, Intel View abstract [PDF] |
Latin Hypercube Designs for SPICE Modeling Presenter: Karen McGaughey, Advanced Micro Devices, Inc. View abstract [PDF] |
Lithography Cell Productivity Improvement Approaches Presenter: Stefan Hempel, AMD View abstract [PDF] |
| 11:10 AM | The Value of Data Visualization and Structured Systems for Turning Data Into Information Presenter: Thomas Quarg, AMD-Dresden-Industrial Engineering View abstract [PDF] |
The Role of Point Of Use Abatement In Sustainable Manufacturing Presenter: Jan Holsbrink, ISMI View abstract [PDF] |
Wafer-to-Wafer Virtual Metrology Applied to Run-to-Run Control Presenter: Jerome Besnard, Si Automation View abstract [PDF] |
AMHS Facade for Increased Tool Utilization Presenter: Carmen Maxim, AMD View abstract [PDF] |
| 11:35 AM | Managing Queue Timers Across Multiple PROMIS Procedures Presenter: Arturo Perez, Freescale Semiconductor Inc. View abstract [PDF] |
Developing an Overall Climate Change Program Presenter: Tim Higgs, Intel View abstract [PDF] |
On a Technique for Measurement System Analysis of Defect Metrology Presenter: Kevin Anderson, Intel Corporation View abstract [PDF] |
Logistical Control For Automated Reticle Handling: From System Start Up to Optimization Presenter: Richard Burda, IBM View abstract [PDF] |
| 12:00 PM | NPW Cost Reduction Management - Prolonging Reclaim Wafer Lifetime Presenter: KT. Kuo, tsmc View abstract [PDF] |
Development Of A Supply Chain Code of Conduct Management Framework In the Electronics Industry Presenter: Robert Leet, Intel Corporation View abstract [PDF] |
TBD | Cycle Time Reduction through Even Based Management Approach in 300mm Wafer Foundry Presenter: Mohd Azizi Chik, Chartered Semiconductor Manufacturing Ltd. View abstract [PDF] |
| 12:25 PM | Lunch | |||
| Session 5: Equipment Productivity Session Chairs: Neal Marmillion |
Session 6: ESH - Design for ESH Session Chairs: James Beasley |
Session 7: Statistical Methods 2 - Statistical Process Control Session Chairs: Diane K. Michelson |
Session 8: Yield/Metrology (1) Session Chairs: Ron Remke |
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| 02:00 PM | Stand-Alone CMP Polisher Throughput Improvement Utilizing a Continuous Load / Unload Method Presenter: Bill Bellamak, Freescale Semiconductor View abstract [PDF] |
Design for Maintainability in the Semiconductor Industry Presenter: Nathan Rucker, Sagittal Systems, LLC View abstract [PDF] |
Advanced Statistical Process Control Using A Machine Learning Approach Based on Spatial Metrology Information Presenter: Severine Marquet, ST Microelectronics, Crolles 2 View abstract [PDF] |
A Comprehensive Framework for the Management and Reduction of Defect Related Yield Loss During New Technology Introduction Presenter: Daniel Gardner, Hewlett-Packard Company View abstract [PDF] |
| 02:25 PM | Electrostatic Chuck Cleaning Options for EUV - Lithography Tools Presenter: Andrew C Rudack, SEMATECH-North View abstract [PDF] |
What Was the Environmental Benefit of the 300mm Conversion? Presenter: John Harland, Intel Corporation View abstract [PDF] |
SPC Sampling Frequency in the Wafer Fab Presenter: Diane K. Michelson, ISMI View abstract [PDF] |
Integrated 3D scatterometry as Enabler for Recess Uniformity Control Presenter: Barbara Schmidt , Qimonda Dresden GmbH&Co. View abstract [PDF] |
| 02:50 PM | Identification and Elimination of Sources of Dynamic Particle Generation in Vertical Furnace Wafer Loading Areas Presenter: Chris Whitesell, Texas Instruments/DMOS6 View abstract [PDF] |
Applied Materials Energy Conservation Worksheet Presenter: Lauren Crane, Applied Materials View abstract [PDF] |
Implementation of Rules Based Routing for Optimization of Statistical Process Control Sampling Presenter: John Kleinhenz, Hewlett Packard View abstract [PDF] |
Automated Regression Test Selection for Optical Proximity Correction Presenter: David DeMaris, IBM Systems and Technology Group View abstract [PDF] |
| 03:15 PM | Break | |||
| Session 5: Equipment Productivity (cont.) Session Chairs: Neal Marmillion |
Session 6: ESH - Design for ESH (cont.) Session Chairs: James Beasley |
Session 7: Statistical Methods 2 - Statistical Process Control (cont.) Session Chairs: Diane K. Michelson |
Session 8: Yield/Metrology (1) (cont.) Session Chairs: Ron Remke |
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| 03:45 PM | Rapid Tool Installation - Defining the Process for Adapter Plates Presenter: Kandi Collier, Intel / Strategic Facilities Technology Development View abstract [PDF] |
Advanced Manufacturing and Human Performance Measurements - Doing More with LESS - Ergonomics & Six Sigma Presenter: Jessica Ellison, EORM (Environmental & Occupational Risk Management View abstract [PDF] |
Statistical Control of Planned Process Time Parameters In a 300mm Semiconductor Manufacturing Environment Presenter: Ben Wheeler, IBM View abstract [PDF] |
Real-time Excursion Control for Manufacturing Effectiveness Presenter: Erez Golan, Applied Materials View abstract [PDF] |
| 04:10 PM | CMP Productivity Improvement Using Pad Surface Management Presenter: Daren Dance, Wright Williams & Kelly, Inc. View abstract [PDF] |
Market-Based Framework for Semiconductor Industry Growth with Reduced Ecological Impact Presenter: Dawood Abugharbieh, Portland State University View abstract [PDF] |
Modified Q Control Charts for Semiconductor Manufacturing in the Presence of Lot to Lot Variation Presenter: Hyun Cheol Lee, Samsung Electronics Co.,Ltd. View abstract [PDF] |
A Yield Improvement Methodology for Launching New Technologies Presenter: Jiu-Qi (Jesse) Huang, IBM Corporation View abstract [PDF] |
| 04:35 PM | Compensation of Process Drifts Using a Run-to-Run Thickness Controller vs. Open-Loop Algorithm on Metal Sputter Systems Presenter: Frank Wagenbreth, AMD View abstract [PDF] |
Human Factors and Serviceability Challenges of Semiconductor Manufacturing Equipment Design Presenter: Ronald Macklin, Applied Materials, Inc. View abstract [PDF] |
Effective Use of Process Capability Indices for Supplier Management Presenter: David Drain, University of Missouri-Rolla View abstract [PDF] |
A Low Cost Automated Wafermap Spatial Signature Classification System For Early Low Yield Triggering Presenter: Jin Yu, Systems on Silicon Manufacturing. Co. Ltd, Singapore View abstract [PDF] |
| 05:00 PM | Reception/Exhibits/Poster Session | |||
Wednesday, October 11, 2006 |
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| 07:00 AM | Breakfast | |||
| Session 9: Yield/Metrology (2) Session Chairs: Dilip Patel |
Session 10: ESH - Green Fab Challenge Session Chairs: James Beasley |
Session 11: Statistical Methods 3 - Statistical Theory & Applications Session Chairs: Diane K. Michelson |
Session 12: e-Manufacturing Session Chairs: Brad Van Eck |
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| 08:30 AM | ROI of Metrology Presenter: Ben Bunday, ISMI View abstract [PDF] |
Approach to Sustainable Operations Evaluate - Innovate - Integrate. Presenter: Catherine Greener , DOMANI Sustainability Consulting LLC View abstract [PDF] |
Development to High -Volume Manufacturing: Reducing the Risks Presenter: David Drain, University of Missouri-Rolla View abstract [PDF] |
Renesas' EES Implementation Strategy and Experience Based on EEQA Presenter: Shigeru Kobayashi, Renesas View abstract [PDF] |
| 08:55 AM | In-Line Partial Die Inspection Methodology for Edge Yield Improvement Presenter: Scott Hiemke, Texas Instruments View abstract [PDF] |
Connect The Green Dots for Fun and Profit Presenter: Paul Westbrook, Texas Instruments View abstract [PDF] |
How Much Do You Lose? Treating (Quasi) Continuous Measurements As Binary Responses. Presenter: George Weaver, Hewlett Packard View abstract [PDF] |
Renesas' EES Implementation Strategy and Experience Based on EEQA Presenter: Shigeru Kobayashi, Renesas View abstract [PDF] |
| 09:20 AM | Wafer Inspection with DUV Wavelengths Presenter: Uwe Seifert, Qimonda View abstract [PDF] |
Challenges For A LEED for Fabs Presenter: Allan Chasey, Arizona State University View abstract [PDF] |
Variance Components: A Practical Study in Random Effects Models Presenter: EunJoo Lee, Advanced Micro Devices, Inc. View abstract [PDF] |
Enabling Virtual Manufacturing with Service-Oriented Architecture Presenter: Karl Gartland, IBM View abstract [PDF] |
| 09:45 AM | Break | |||
| Session 9: Yield/Metrology (2) (cont.) Session Chairs: Dilip Patel |
Session 10: ESH - Green Fab Challenge (cont.) Session Chairs: James Beasley |
Session 11: Statistical Methods 3 - Statistical Theory & Applications (cont.) Session Chairs: Diane K. Michelson |
Session 12: e-Manufacturing (cont.) Session Chairs: Brad Van Eck |
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| 10:15 AM | Effect and Detection of Sub 80nm Particles On A 130nm Logic Process Presenter: Michael Satterfield, Texas Instruments/DMOS6 Yield Enhancement View abstract [PDF] |
Vision for Sustainability: Green Products Made with Green Processes in Green Fabs, Enabling Sustainable Communities Presenter: Ted Reichelt, Intel View abstract [PDF] |
Defective Wafer Detection Using Multiple Classifiers Presenter: Abderrahmane Boubezoul, Onwafer View abstract [PDF] |
Unearthing Buried Treasure in Your Fab: Building Value with Interface A Presenter: Alan Weber, Alan Weber & Associates, Inc. View abstract [PDF] |
| 10:40 AM | Defectively Sampling Rate Tuning System (SRTS) Forecast System Presenter: Kevin Lee, SSMC Co Pte Ltd View abstract [PDF] |
Panel Discussion | Evaluation of Particle Counts Using Gamma Distributions Presenter: Robert Henderson, Samsung Austin Semiconductor View abstract [PDF] |
Toward Data-Driven Manufacturing Presenter: Shin-ichi Imai, Matsushita Electric Industrial View abstract [PDF] |
| 11:05 AM | Defect Feedback System at AMD Fab36 Presenter: Remo Kirsch, AMD View abstract [PDF] |
Panel Discussion | Sequential Analysis on Misspecified Distributions Presenter: Theresa Utlaut, Intel Corporation View abstract [PDF] |
Optimizing a Photo Run by Run Control System Presenter: Matt Lauderdale, Freescale Semiconductor View abstract [PDF] |
| 11:30 AM | Lunch | |||
| Session 13: 300 Prime / 450mm Technical Briefing Session Chairs: Denis Fandel |
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| 01:00 PM | Introduction and Opening Remarks Presenter: Denis Fandel, ISMI |
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| 01:15 PM | Overview of ISMI Program Presenter: Thomas Abell, ISMI |
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| 01:45 PM | Starting Materials Presenter: Thomas McKenna, Texas Instruments |
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| 02:15 PM | Factory Architecture Presenter: KT Kuo, tsmc |
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| 02:45 PM | Break | |||
| Bergstrom Ballroom |
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| Session 13: 300 Prime / 450mm Technical Briefing (cont.) Session Chairs: Denis Fandel |
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| 03:15 PM | Factory Simulation Presenter: Eddy Bass, Intel |
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| 03:45 PM | Economic Analysis Presenter: Marcus Lentz, AMD |
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| 04:15 PM | Closing Remarks/Next Steps Presenter: Thomas Abell, Intel |
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| 04:30 PM | Audience Q&A with Speakers Presenter: Denis Fandel, ISMI |
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| 05:00 PM | Adjourn | |||
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