3rd ISMI Symposium on Manufacturing Effectiveness

Schedule of Technical Sessions Presentations and Speakers

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Monday, October 09, 2006

  Member Company Only Session
04:00 PM Registration Open
05:00 PM Reception/Exhibits/Poster Session

Tuesday, October 10, 2006

07:00 AM Breakfast
  Welcome and Introductions
Session Chairs: Mike Schwartz
08:00 AM Opening Remarks
Presenter: Mike Schwartz, Meeting Chair; Scott Kramer, Director, ISMI
08:15 AM Welcome
Presenter: OB Bilous, SEMATECH, Board of Directors
  General Session/Keynote
Session Chairs: Mike Schwartz
08:30 AM Advanced SoC Manufacturing in Digital Consumer Electronics Era
Presenter: Michihiro Inoue, Matsushita Electric Industrial Co., Ltd
View abstract [PDF]
Session 1:  Fab Productivity
Session Chairs: Mike Schwartz
Session 2:  ESH - Manufacturing Sustainability
Session Chairs: James Beasley
Session 3:  Statistical Methods 1 - Approaches to Yield & Metrology
Session Chairs: Diane K. Michelson
Session 4:  Simulation and Modeling
Session Chairs: Robert Wright
09:25 AM Productivity Improvements Through Range Management Dispatching In 300mm Wafer Manufacturing
Presenter: Sameer Shikalgar, IBM
View abstract [PDF]
Enhancing Manufacturing Sustainability by Reducing Fab Liquid Wastes
Presenter: Walter Worth, SEMATECH
View abstract [PDF]
Competing on Analytics
Presenter: Brad Hopper, Spotfire, Inc.
View abstract [PDF]
The Exploitation of Manufacturing's 3rd and 4th Dimensions
Presenter: James Ignizio, Intel Corporation/F11x ME
View abstract [PDF]
09:50 AM Understand and Manage Work-Center Variability
Presenter: Yutong Wu, IBM
View abstract [PDF]
Energy Reduction and Its Impact to Existing Semiconductor Manufacturing Facilities
Presenter: Phillip Herman, Texas Instruments
View abstract [PDF]
Hierarchical Modeling Using GLMs to Improve Yield
Presenter: Christina Mastrangelo, University of Washington
View abstract [PDF]
Integrated Capacity and Cycle Time Modeling and Optimization With EPOS
Presenter: Horst Zisgen, IBM
View abstract [PDF]
10:15 AM Break Break
  Session 1:  Fab Productivity (cont.)
Session Chairs: Mike Schwartz
Session 2:  ESH - Manufacturing Sustainability (cont.)
Session Chairs: James Beasley
Session 3:  Statistical Methods 1 - Approaches to Yield & Metrology (cont.)
Session Chairs: Diane K. Michelson
Session 4:  Simulation and Modeling (cont.)
Session Chairs: Robert Wright
10:45 AM Improving Fab Productivity Through Organizational Change
Presenter: Steve Eckhart, Hewlett-Packard
View abstract [PDF]
Two Generations Ahead - Intel's Wastewater Goal Setting Process
Presenter: John Currier, Intel
View abstract [PDF]
Latin Hypercube Designs for SPICE Modeling
Presenter: Karen McGaughey, Advanced Micro Devices, Inc.
View abstract [PDF]
Lithography Cell Productivity Improvement Approaches
Presenter: Stefan Hempel, AMD
View abstract [PDF]
11:10 AM The Value of Data Visualization and Structured Systems for Turning Data Into Information
Presenter: Thomas Quarg, AMD-Dresden-Industrial Engineering
View abstract [PDF]
The Role of Point Of Use Abatement In Sustainable Manufacturing
Presenter: Jan Holsbrink, ISMI
View abstract [PDF]
Wafer-to-Wafer Virtual Metrology Applied to Run-to-Run Control
Presenter: Jerome Besnard, Si Automation
View abstract [PDF]
AMHS Facade for Increased Tool Utilization
Presenter: Carmen Maxim, AMD
View abstract [PDF]
11:35 AM Managing Queue Timers Across Multiple PROMIS Procedures
Presenter: Arturo Perez, Freescale Semiconductor Inc.
View abstract [PDF]
Developing an Overall Climate Change Program
Presenter: Tim Higgs, Intel
View abstract [PDF]
On a Technique for Measurement System Analysis of Defect Metrology
Presenter: Kevin Anderson, Intel Corporation
View abstract [PDF]
Logistical Control For Automated Reticle Handling: From System Start Up to Optimization
Presenter: Richard Burda, IBM
View abstract [PDF]
12:00 PM NPW Cost Reduction Management - Prolonging Reclaim Wafer Lifetime
Presenter: KT. Kuo, tsmc
View abstract [PDF]
Development Of A Supply Chain Code of Conduct Management Framework In the Electronics Industry
Presenter: Robert Leet, Intel Corporation
View abstract [PDF]
TBD Cycle Time Reduction through Even Based Management Approach in 300mm Wafer Foundry
Presenter: Mohd Azizi Chik, Chartered Semiconductor Manufacturing Ltd.
View abstract [PDF]
12:25 PM Lunch
Session 5:  Equipment Productivity
Session Chairs: Neal Marmillion
Session 6:  ESH - Design for ESH
Session Chairs: James Beasley
Session 7:  Statistical Methods 2 - Statistical Process Control
Session Chairs: Diane K. Michelson
Session 8:  Yield/Metrology (1)
Session Chairs: Ron Remke
02:00 PM Stand-Alone CMP Polisher Throughput Improvement Utilizing a Continuous Load / Unload Method
Presenter: Bill Bellamak, Freescale Semiconductor
View abstract [PDF]
Design for Maintainability in the Semiconductor Industry
Presenter: Nathan Rucker, Sagittal Systems, LLC
View abstract [PDF]
Advanced Statistical Process Control Using A Machine Learning Approach Based on Spatial Metrology Information
Presenter: Severine Marquet, ST Microelectronics, Crolles 2
View abstract [PDF]
A Comprehensive Framework for the Management and Reduction of Defect Related Yield Loss During New Technology Introduction
Presenter: Daniel Gardner, Hewlett-Packard Company
View abstract [PDF]
02:25 PM Electrostatic Chuck Cleaning Options for EUV - Lithography Tools
Presenter: Andrew C Rudack, SEMATECH-North
View abstract [PDF]
What Was the Environmental Benefit of the 300mm Conversion?
Presenter: John Harland, Intel Corporation
View abstract [PDF]
SPC Sampling Frequency in the Wafer Fab
Presenter: Diane K. Michelson, ISMI
View abstract [PDF]
Integrated 3D scatterometry as Enabler for Recess Uniformity Control
Presenter: Barbara Schmidt , Qimonda Dresden GmbH&Co.
View abstract [PDF]
02:50 PM Identification and Elimination of Sources of Dynamic Particle Generation in Vertical Furnace Wafer Loading Areas
Presenter: Chris Whitesell, Texas Instruments/DMOS6
View abstract [PDF]
Applied Materials Energy Conservation Worksheet
Presenter: Lauren Crane, Applied Materials
View abstract [PDF]
Implementation of Rules Based Routing for Optimization of Statistical Process Control Sampling
Presenter: John Kleinhenz, Hewlett Packard
View abstract [PDF]
Automated Regression Test Selection for Optical Proximity Correction
Presenter: David DeMaris, IBM Systems and Technology Group
View abstract [PDF]
03:15 PM Break
  Session 5:  Equipment Productivity (cont.)
Session Chairs: Neal Marmillion
Session 6:  ESH - Design for ESH (cont.)
Session Chairs: James Beasley
Session 7:  Statistical Methods 2 - Statistical Process Control (cont.)
Session Chairs: Diane K. Michelson
Session 8:  Yield/Metrology (1) (cont.)
Session Chairs: Ron Remke
03:45 PM Rapid Tool Installation - Defining the Process for Adapter Plates
Presenter: Kandi Collier, Intel / Strategic Facilities Technology Development
View abstract [PDF]
Advanced Manufacturing and Human Performance Measurements - Doing More with LESS - Ergonomics & Six Sigma
Presenter: Jessica Ellison, EORM (Environmental & Occupational Risk Management
View abstract [PDF]
Statistical Control of Planned Process Time Parameters In a 300mm Semiconductor Manufacturing Environment
Presenter: Ben Wheeler, IBM
View abstract [PDF]
Real-time Excursion Control for Manufacturing Effectiveness
Presenter: Erez Golan, Applied Materials
View abstract [PDF]
04:10 PM CMP Productivity Improvement Using Pad Surface Management
Presenter: Daren Dance, Wright Williams & Kelly, Inc.
View abstract [PDF]
Market-Based Framework for Semiconductor Industry Growth with Reduced Ecological Impact
Presenter: Dawood Abugharbieh, Portland State University
View abstract [PDF]
Modified Q Control Charts for Semiconductor Manufacturing in the Presence of Lot to Lot Variation
Presenter: Hyun Cheol Lee, Samsung Electronics Co.,Ltd.
View abstract [PDF]
A Yield Improvement Methodology for Launching New Technologies
Presenter: Jiu-Qi (Jesse) Huang, IBM Corporation
View abstract [PDF]
04:35 PM Compensation of Process Drifts Using a Run-to-Run Thickness Controller vs. Open-Loop Algorithm on Metal Sputter Systems
Presenter: Frank Wagenbreth, AMD
View abstract [PDF]
Human Factors and Serviceability Challenges of Semiconductor Manufacturing Equipment Design
Presenter: Ronald Macklin, Applied Materials, Inc.
View abstract [PDF]
Effective Use of Process Capability Indices for Supplier Management
Presenter: David Drain, University of Missouri-Rolla
View abstract [PDF]
A Low Cost Automated Wafermap Spatial Signature Classification System For Early Low Yield Triggering
Presenter: Jin Yu, Systems on Silicon Manufacturing. Co. Ltd, Singapore
View abstract [PDF]
05:00 PM Reception/Exhibits/Poster Session

Wednesday, October 11, 2006

07:00 AM Breakfast
Session 9:  Yield/Metrology (2)
Session Chairs: Dilip Patel
Session 10:  ESH - Green Fab Challenge
Session Chairs: James Beasley
Session 11:  Statistical Methods 3 - Statistical Theory & Applications
Session Chairs: Diane K. Michelson
Session 12:  e-Manufacturing
Session Chairs: Brad Van Eck
08:30 AM ROI of Metrology
Presenter: Ben Bunday, ISMI
View abstract [PDF]
Approach to Sustainable Operations Evaluate - Innovate - Integrate.
Presenter: Catherine Greener , DOMANI Sustainability Consulting LLC
View abstract [PDF]
Development to High -Volume Manufacturing: Reducing the Risks
Presenter: David Drain, University of Missouri-Rolla
View abstract [PDF]
Renesas' EES Implementation Strategy and Experience Based on EEQA
Presenter: Shigeru Kobayashi, Renesas
View abstract [PDF]
08:55 AM In-Line Partial Die Inspection Methodology for Edge Yield Improvement
Presenter: Scott Hiemke, Texas Instruments
View abstract [PDF]
Connect The Green Dots for Fun and Profit
Presenter: Paul Westbrook, Texas Instruments
View abstract [PDF]
How Much Do You Lose? Treating (Quasi) Continuous Measurements As Binary Responses.
Presenter: George Weaver, Hewlett Packard
View abstract [PDF]
Renesas' EES Implementation Strategy and Experience Based on EEQA
Presenter: Shigeru Kobayashi, Renesas
View abstract [PDF]
09:20 AM Wafer Inspection with DUV Wavelengths
Presenter: Uwe Seifert, Qimonda
View abstract [PDF]
Challenges For A LEED for Fabs
Presenter: Allan Chasey, Arizona State University
View abstract [PDF]
Variance Components: A Practical Study in Random Effects Models
Presenter: EunJoo Lee, Advanced Micro Devices, Inc.
View abstract [PDF]
Enabling Virtual Manufacturing with Service-Oriented Architecture
Presenter: Karl Gartland, IBM
View abstract [PDF]
09:45 AM Break
  Session 9:  Yield/Metrology (2) (cont.)
Session Chairs: Dilip Patel
Session 10:  ESH - Green Fab Challenge (cont.)
Session Chairs: James Beasley
Session 11:  Statistical Methods 3 - Statistical Theory & Applications (cont.)
Session Chairs: Diane K. Michelson
Session 12:  e-Manufacturing (cont.)
Session Chairs: Brad Van Eck
10:15 AM Effect and Detection of Sub 80nm Particles On A 130nm Logic Process
Presenter: Michael Satterfield, Texas Instruments/DMOS6 Yield Enhancement
View abstract [PDF]
Vision for Sustainability: Green Products Made with Green Processes in Green Fabs, Enabling Sustainable Communities
Presenter: Ted Reichelt, Intel
View abstract [PDF]
Defective Wafer Detection Using Multiple Classifiers
Presenter: Abderrahmane Boubezoul, Onwafer
View abstract [PDF]
Unearthing Buried Treasure in Your Fab: Building Value with Interface A
Presenter: Alan Weber, Alan Weber & Associates, Inc.
View abstract [PDF]
10:40 AM Defectively Sampling Rate Tuning System (SRTS) Forecast System
Presenter: Kevin Lee, SSMC Co Pte Ltd
View abstract [PDF]
Panel Discussion Evaluation of Particle Counts Using Gamma Distributions
Presenter: Robert Henderson, Samsung Austin Semiconductor
View abstract [PDF]
Toward Data-Driven Manufacturing
Presenter: Shin-ichi Imai, Matsushita Electric Industrial
View abstract [PDF]
11:05 AM Defect Feedback System at AMD Fab36
Presenter: Remo Kirsch, AMD
View abstract [PDF]
Panel Discussion Sequential Analysis on Misspecified Distributions
Presenter: Theresa Utlaut, Intel Corporation
View abstract [PDF]
Optimizing a Photo Run by Run Control System
Presenter: Matt Lauderdale, Freescale Semiconductor
View abstract [PDF]
11:30 AM Lunch
Session 13:  300 Prime / 450mm Technical Briefing
Session Chairs: Denis Fandel
01:00 PM Introduction and Opening Remarks
Presenter: Denis Fandel, ISMI
01:15 PM Overview of ISMI Program
Presenter: Thomas Abell, ISMI
01:45 PM Starting Materials
Presenter: Thomas McKenna, Texas Instruments
02:15 PM Factory Architecture
Presenter: KT Kuo, tsmc
02:45 PM Break
  Bergstrom BallroomReturn to top
  Session 13:  300 Prime / 450mm Technical Briefing (cont.)
Session Chairs: Denis Fandel
03:15 PM Factory Simulation
Presenter: Eddy Bass, Intel
03:45 PM Economic Analysis
Presenter: Marcus Lentz, AMD
04:15 PM Closing Remarks/Next Steps
Presenter: Thomas Abell, Intel
04:30 PM Audience Q&A with Speakers
Presenter: Denis Fandel, ISMI
05:00 PM Adjourn