| Abstract |
Magnetic Fields and the Technology Challenges They Pose to Beam-Based Equipment as Process Technology Progresses into the Future |
Julian Montoya, Intel |
| Abstract |
Tool or Facility - What Should it Be? |
Hal Amick, Colin Gordon and Associates |
| Abstract |
Integration of AMC Concepts into Future Wafer Fabs |
Andreas Neuber, M+W Zander |
| Abstract |
Cost Impact of Ovestated tool FLA on facility design |
Phil Sarikas - Intel |
| Abstract |
Flexible Fab Design to Accommodate Various Business Needs |
Todd Lasater, Intel |
