00023901A-ENG Abstract: Backend Wafer Carrier Global Joint Guidance for 300 mm Semiconductor Factories

SEMATECH DOC ID #: 00023901A-ENG

Title: Backend Wafer Carrier Global Joint Guidance for 300 mm Semiconductor Factories

Author(s): I300I;J300E;

Document date: 02/25/2000

Descriptor(s): 300 mm wafers;CIM;wafer carriers;

Abstract: This document was created by the International 300 mm Initiative (I300I) and
Japan 300 mm Semiconductor Technology Group (J300E) consortia to provide
joint consensus guidance for the semiconductor industry suppliers regarding
expectations of member semiconductor device companies of these consortia for
backend wafer carriers. This guidance extends the existing joint consensus
between I300I and J300E on backend frame cassettes to cover backend wafer
carriers. These guidelines are designed to ensure that the industry fully
realizes potential 300 mm productivity benefits.

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