99083810A-XFR Abstract: Use Condition Based Reliability Evaluation of New Semiconductor Technologies

SEMATECH DOC ID #: 99083810A-XFR

Title: Use Condition Based Reliability Evaluation of New Semiconductor Technologies

Author(s): Noel Durrant;

Document date: 08/20/1999

Descriptor(s): modeling;packaging;reliability;strategic planning;

Abstract: The use conditions methodology offers a reliability evaluation methodology
based on the use conditions a component is expected to encounter in its market
applications. Package/assembly technologies are utilized throughout this white
paper as examples for clarity. However, the concepts are directly applicable
to silicon and product technologies. The use condition methodology is based on
an understanding of the end user conditions expected to be encountered by the
technology. Based on this understanding, detailed process steps are described
for the supplier to establish the reliability stress program and evaluate all
encountered failure mechanisms. Three major end use segment s were developed
as examples for this paper: Indoor, Mobile, and Other. An understanding of the
failure mechanisms, acceleration models, and their relation to the component's
application is included in the qualification procedure. Compared to
stress-based methods, this approach requires more knowledge about the physics
of failure mechanisms and about the anticipated use of the component.

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