97093360C-ENG Abstract: 180 nm Equipment Performance Metrics

SEMATECH DOC ID #: 97093360C-ENG

Title: 180 nm Equipment Performance Metrics - Revision 1

Author(s): Kamal Benhayoune;Venkat Swaminathan;

Document date: 09/01/1998

Descriptor(s): 300 mm wafers;equipment performance;cost of ownership;wafer size conversion;

Abstract: This document represents the expanded expectations of the International 300
mm Initiative (I300I) member companies for 300 mm equipment performance for
180 nm technology in 1999. These metrics will be used as targets for I300I
equipment demonstrations in 1998. They were developed and agreed upon in
consensus by the I300I Pattern and Process Advisory Group and the Metrology
and Factory Integration Working Groups. The results of SEMATECH's
Cost/Resource Model (CRM) have been updated to reflect cost of ownership
(CoO) values. The individual equipment sheets conform to the format jointly
developed by I300I and SELETE. The modularized 180 nm process flows used as a
basis for the development of these metrics are included. Assumptions used for
generating the process metrics align with those of the 1997 Semiconductor
Industry Association (SIA) National Technology Roadmap for Semiconductors.
The document contains all tool types except for Cu interconnect technology,
DRAM storage node equipment requirements, and backend,; however, it meets the
spirit of 100% coverage for semiconductor front-end fab equipment
commensurate with the modular process flow described in this document.

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