96063141A-ENG Abstract: Advanced Process Control (APC): Run-to-Run Process Control Development

SEMATECH DOC ID #: 96063141A-ENG

Title: Advanced Process Control (APC): Run-to-Run Process Control Development - Interim Report

Author(s): Arnon Hurwitz;

Document date: 08/22/1996

Descriptor(s): advanced process control;chemical mechanical polishing;computers;computer software;design of experiments;frameworks;computer hardware;planarization;

Abstract: This interim report presents the conclusions of several cycles of
experiments: two design of experiments (DOEs) from project J88-D were
executed by Motorola engineers on furnaces at the Bipolar1 plant in Tempe,
AZ; two DOEs were designed and executed by Lucent Technologies engineers at
their Orlando, FL, plant on chemical-mechanical planarization (CMP); and two
DOEs were designed and run at Strasbaugh Inc., on its 6DS-SP two-head
planarizer. In addition, J88-D, in conjunction with Strasbaugh Inc., ran a
600+ blanket tetraethlyorthosilicate (TEOS) wafer controller DOE on the 6DS-
SP to prove the feasibility of differential polish-head control under a time-
based formulation of the MIT Gradual Mode time-based (GMt) controller.
Despite fluctuations in removal rate, which also varied from head to head,
the amount removed remained uniform. Two reports preceded this document:
Advanced Process Control (APC) Development: Application to the Westech Avanti
472 (Technology Transfer #94102593A-ENG) and Advanced Process Control (APC)--
Process Control Development: Application to a Westech Planarizer (Technology
Transfer #95102986A-ENG).

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