96043107B-ENG Abstract: Wire Bonder Specific Equipment Model (SEM) Rev 2.0

SEMATECH DOC ID #: 96043107B-ENG

Title: Wire Bonder Specific Equipment Model (SEM) Rev 2.0

Author(s):

Document date: 12/03/1997

Descriptor(s): automation;CIM;equipment modeling;generic equipment model;operational modeling;packaging equipment;wire bonding;

Abstract: This document updates and expands the SEMATECH Wire Bonder Specific Equipment
Model (WBSEM). The model consists of equipment characteristics and behaviors
that apply to such equipment and that are consistent with supporting SEMI
standards, including the Generic Equipment Model (GEM) and Semiconductor
Equipment Communications Standards 1 and 2 (SECS-I and SECS-II). The model is
designed to facilitate the integration of wire bonding equipment into an
automated semiconductor factory. This version of WBSEM includes
simplification of the Process State Model, removal of Common SEM sections,
updated Bond Map and Strip Map sections, and other changes. This document is
part of a series of SEMATECH-developed Specific Equipment Models (SEMs);
others include SEMATECH Stepper Specific Equipment Model (SEM), Technology
Transfer #95042782A-ENG; SEMATECH Metrology Specific Equipment Model (MSEM),
Technology Transfer #95042793A-ENG; SEMATECH Inspection/Review Specific
Equipment Model (ISEM), Technology Transfer #95042797A-ENG; and SEMATECH
Apply/Develop Track Specific Equipment Model (ADTSEM), Version 0.8,
Technology Transfer #95113021A-ENG.

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