SEMATECH DOC ID #: 94112638A-XFR

Title: Evaluating Automated Wafer Measurement Instruments

Author(s): Steven A. Eastman;

Document date: 03/02/1995

Descriptor(s): measurement capability analysis;analysis of variance;measuring instruments;automation;automated materials handling;statistical methods;repeatability;reproducibility;precision;accuracy;

Abstract:  This document demonstrates a sequential process of evaluating automated wafer
instruments and discusses why this approach is useful for studying instruments
that have automation features such as loading and focusing mechanisms. The
methodology specifies a series of experiments consisting of two or more
capability studies followed by a stability study. Each experiment achieves a
separate goal, yet combines with the others in providing information needed to
assess the usefulness of the instrument. The Analysis of Variance (ANOVA)
method of estimating variance components in a nested model is shown to provide
information for comparing sources of variation, for assessing the stability of
the variation, and for identifying causes of measurement instability.

To Document

© Copyright 2008 SEMATECH, Inc.
Please read these important Trademark and legal notices