94052358A-STD Abstract: An Extractive Method for Determining Particulate Contamination Levels of Wafer Carriers Using Ultrasonic Extraction: SEMASPEC

SEMATECH DOC ID #: 94052358A-STD

Title: An Extractive Method for Determining Particulate Contamination Levels of Wafer Carriers Using Ultrasonic Extraction: SEMASPEC

Author(s): Dr. Nagarajan;

Document date: 10/13/1994

Descriptor(s): SMIF;particulate contamination;measurement;specifications;200 mm wafers;particle count;

Abstract: This specification defines a quantitative measurement method for particulate
contamination on the functional surfaces of wafer carriers. This method uses
ultrasonic extraction to remove surface contamination and to suspend it in an
aqueous solution. A portion of the solution is measured with a liquid-borne
particle counter (LPC) to determine the concentration of particles with
respect to various sizes. The particle size range that this specification
addresses is 0.5 micron to 60 micron. This method will measure cleaning
processes to a level that allows six sigma control.

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